Konektè Kat Mikwo SIM, 8Pin H1.5mm, Kalite ak gon KLS1-SIM-089
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| Konektè Kat Mikwo SIM, 8Pin H1.5mm, Kalite ak gon Materyèl Lojman: Tèmoplastik, UL94V-0. Tèminal: Bwonz fosfò, T = 0.15, NiPlake Anba, Au Plake Sou KontakZòn, G/F plake sou Soldertail. Koki: Asye pur, T = 0.15, Ni plakeAnba, G/F plake sou Soldertail. Elektrik Rezistans kontak: 60mΩ Maks. Rezistans izolasyon: 1000MΩ Min. Vòltaj rezistans dyelèktrik: 500V AC pou1 minit. Durabilite: 5000 Sik. Tanperati Operasyon: -45ºC ~ +85ºC |
| Nimewo Pati | Deskripsyon | PCS/CTN | GW (KG) | CMB(m3) | Kantite Kòmand. | Tan | Lòd |
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