Konektè Kat Mikwo SIM ak SD 2 an 1, 8P, H2.26mm KLS1-SIM-109
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| Konektè Kat Mikwo SIM ak SD 2 an 1, 8P, H2.26mm Materyèl: Izolan: Tèmoplastik tanperati ki wo, UL94V-0. Nwa. Tèminal: Alyaj kwiv, plake lò nan zòn kontak 1u ", Zòn soudaj dorure 1u" Koki anwo: Asye pur, Plak Nikèl 50u". Kokiy anba: SUS304 R-1/2H T=0.10mm, Plak Nikèl 50u". Elektrik: Fòs Ensèsyon 1kgf Maks. Fòs Retrè 0.1kgf Min. Durabilite: SIM 5000 Sik, Rezistans kontak: Anvan tès la 80mΩ Max, Apre tès la 120Ω Max. Rezistans izolasyon: 1000MΩ Vòltaj ki reziste: 500V AC pou 1 minit. Tanperati Operasyon: -45ºC ~ +85ºC |
| Nimewo Pati | Deskripsyon | PCS/CTN | GW (KG) | CMB(m3) | Kantite Kòmand. | Tan | Lòd |
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